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Semiconductor

Wafer Laser Cutting

In the semiconductor manufacturing industry, wafer laser cutting technology offers a high-precision, high-efficiency, and cost-effective solution for wafer segmentation. These characteristics are crucial for ensuring the quality of semiconductor products, enhancing production efficiency, and reducing costs.

Semiconductor Production Line Intelligent Upgrading Solutions

Applied to wafer laser cutting equipment, the solution integrates functional modules such as Load Port, Wafer Robot, and SSA to provide stable and reliable wafer loading and transfer capabilities. The Aligner performs preliminary centering and angle positioning of the wafer, while the Stage ensures precise fixation at the processing position or facilitates smooth trajectory movement. These solutions help enhance the accuracy and stability of wafer processing, thereby achieving more efficient production operations.

wafer_laser_cutting

* Click the product in the image to view detailed features.

RWDE Dual-arm Wafer Robot
Features
  • Utilizes high-precision, high-rigidity direct-drive motors.
  • Achieves repeatability of ±0.1mm, with a small turning radius and high space utilization.
  • Can be paired with HIWIN's self-manufactured key components and independently developed software applications.
Advantages
  • Vertical integration of hardware and software, with HIWIN providing customers with a complete solution.
Wafer Aligner
Features
  • Multi-axis control using HIWIN's self-manufactured key components.
  • Provides precise wafer centering and angle positioning functions.
Advantages
  • Accurate positioning and stable movement ensure precision and consistency of wafer processing.
  • Embedded controller design eliminates the need for additional controllers and wiring space.
  • Complies with the European Restriction of Hazardous Substances (RoHS2) directive, uses the lowest water pollution grade (WGK1) lubricant, and adopts eco-friendly packaging (NBSK).
Load Port
Features
  • Supports loading and unloading of products in multiple sizes, compatible with platforms of various sizes.
  • Can be paired with HIWIN's self-manufactured key components and self-developed software applications.
Advantages
  • HIWIN's in-house development and manufacturing, combined with vertical integration of hardware and software, allows for flexible customization services according to customer needs.
Stage
Features
  • Utilizes the new vacuum preloaded low-energy air bearing technology.
  • Equipped with dynamic reaction force balancing and inertia compensation technology.
Advantages
  • Achieves nanometer-level error requirements, significantly reducing motion settling time and component wear rates.
  • Enhances equipment productivity and reliability, making it suitable for high-precision applications.
Single Axis : Standard
Features
  • Easy installation with fast and accurate positioning capabilities.
  • Includes a Drive, supporting long strokes and multiple movers.
Advantages
  • Offers short lead times, high responsiveness, high precision, and low wear.
  • Enhances production efficiency and capacity through high-speed movement and simultaneous multi-position operation.
s01_001s
rwde_b

RWDE Dual-arm Wafer Robot
Features
  • Utilizes high-precision, high-rigidity direct-drive motors.
  • Achieves repeatability of ±0.1mm, with a small turning radius and high space utilization.
  • Can be paired with HIWIN's self-manufactured key components and independently developed software applications.
Advantages
  • Vertical integration of hardware and software, with HIWIN providing customers with a complete solution.

wafer_aligner_b

Wafer Aligner
Features
  • Multi-axis control using HIWIN's self-manufactured key components.
  • Provides precise wafer centering and angle positioning functions.
Advantages
  • Accurate positioning and stable movement ensure precision and consistency of wafer processing.
  • Embedded controller design eliminates the need for additional controllers and wiring space.
  • Complies with the European Restriction of Hazardous Substances (RoHS2) directive, uses the lowest water pollution grade (WGK1) lubricant, and adopts eco-friendly packaging (NBSK).

load_port_b

Load Port
Features
  • Supports loading and unloading of products in multiple sizes, compatible with platforms of various sizes.
  • Can be paired with HIWIN's self-manufactured key components and self-developed software applications.
Advantages
  • HIWIN's in-house development and manufacturing, combined with vertical integration of hardware and software, allows for flexible customization services according to customer needs.

SSA

Stage
Features
  • Utilizes the new vacuum preloaded low-energy air bearing technology.
  • Equipped with dynamic reaction force balancing and inertia compensation technology.
Advantages
  • Achieves nanometer-level error requirements, significantly reducing motion settling time and component wear rates.
  • Enhances equipment productivity and reliability, making it suitable for high-precision applications.

lmssa

Single Axis : Standard
Features
  • Easy installation with fast and accurate positioning capabilities.
  • Includes a Drive, supporting long strokes and multiple movers.
Advantages
  • Offers short lead times, high responsiveness, high precision, and low wear.
  • Enhances production efficiency and capacity through high-speed movement and simultaneous multi-position operation.