HIWIN LOGO
Technical Support

Wafer Aligner

Feature

Most compact design in industry, support various materials and notch detection functions. Wafer aligning, wafer centering and angle corrections can be finished within 4.9 seconds.

Accuracy of Centering
±0.1 mm
Positioning accuracy (θ)
±0.2°
Wafer aligningtime
<5.9 s
Application
Semiconductor Industry
Technical Support