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RWSE Single-arm Wafer Robot
Features
- Utilizes high-precision, high-rigidity Direct Drive Motor.
- Achieves repeatability of ±0.1mm, has a small turning radius, and optimizes space usage.
- Can be equipped with HIWIN's self-manufactured key components and developed software applications.
Advantages
- Vertical integration of hardware and software, with HIWIN providing customers with complete solutions.
- Customized assembly:Adaptable to specific platform requirements, including under-slung pick-and-place operations and customized end-effectors and forks.
Wafer Aligner
Features
- Multi-axis control using HIWIN's self-manufactured key components.
- Provides precise wafer centering and angle positioning functions.
Advantages
- Accurate positioning and stable movement ensure precision and consistency of wafer processing.
- Embedded controller design eliminates the need for additional controllers and wiring space.
- Complies with the European Restriction of Hazardous Substances (RoHS2) directive, uses the lowest water pollution grade (WGK1) lubricant, and adopts eco-friendly packaging (NBSK).