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semiconductor Semiconductor

Semiconductor

Wafer Laser Annealing Treatment

In semiconductor manufacturing, laser annealing is a critical process technology. By precisely controlling the heating effect of the laser, it is used to enhance the electrical performance, crystalline quality, and other important characteristics of wafers or thin film materials. This technology can effectively improve material quality and precisely regulate the lattice structure, thereby increasing manufacturing efficiency and product consistency.

Requirements for Semiconductor Subsystems

The Wafer Robot ensures the safe movement and accurate positioning of wafers, while the Wafer Aligner ensures the precise irradiation position of the laser. Together, they support the smooth progress of the process and the production of high-quality products.

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* Click the product in the image to view detailed features.

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rws_b

RWS Single-arm Wafer Robot
Features
  • Utilizes high-precision, high-rigidity direct drive motors.
  • Achieves repeatability accuracy of ±0.1mm, has a small turning radius, and optimizes space usage.
  • Can be equipped with HIWIN’s self-manufactured key components and developed software applications.
Advantages
  • Vertical integration of hardware and software, HIWIN provides customers with complete solutions.
  • Customized assembly：Can be tailored to customer needs, including non-radial wafer handling, TT, interference simulation, and fork customization.

wafer_aligner_b

Wafer Aligner
Features
  • Multi-axis control using HIWIN's self-manufactured key components.
  • Provides precise wafer centering and angle positioning functions.
Advantages
  • Accurate positioning and stable movement ensure precision and consistency of wafer processing.
  • Embedded controller design eliminates the need for additional controllers and wiring space.
  • Complies with the European Restriction of Hazardous Substances (RoHS2) directive, uses the lowest water pollution grade (WGK1) lubricant, and adopts eco-friendly packaging (NBSK).