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semiconductor Semiconductor

Semiconductor

Wafer polishing pad measurement equipment

CMP Pad measurement equipment is used to measure and analyze various parameters of CMP pads, such as those used for polishing wafer surfaces. These measurement systems require high operational efficiency and accuracy, as the data is critical for ensuring process stability and product quality.

Providing Single-Axis robots Total Solutions

By integrating single-axis robots, motors, and drives, our solution significantly reduces customers' assembly time and installation space. It also minimizes labor-intensive work and errors, providing a complete motion control solution for stable system operation.

wafer_polishing_pad_measurement_equipment

* Click the product in the image to view detailed features.

s01_004s
kc_b

KC Series Single-Axis Robot
Features
  • Integrated Lightweight Aluminum Extrusion Base：Not only does it reduces overall weight but also improves mobility and ease of installation.
  • High-Precision Ball Screw：As a transmission mechanism, it ensures the accuracy and repeatability of motion, making it suitable for applications requiring high-precision positioning.
  • Lightweight U-Shaped Rail：Serves as a guide mechanism that enhances system efficiency, reduces energy consumption and wear, while also lowering noise.
  • Easy Installation and Maintenance：The integrated design simplifies the installation process without requiring complex tools or steps, and maintenance can be easily carried out with single-point lubrication.
Advantages
  • High Precision：The combination of a high-precision ball screw and guiding system enables the mechanism to accurately repeat precise motion and positioning tasks.
  • High Efficiency：Optimizes energy use and operates at low power consumption, enhancing production and operational efficiency.
  • Wide Range of Applications：Suitable for various automation applications such as automated feeding systems, automated inspection equipment, and automated assembly equipment.

e1

E1 Series AC Servo Motor
Features
  • High-speed low-torque design：Suitable for applications requiring rapid movements, including general-purpose servo motors and integrated servo motors.
  • Easy installation：Provides a quick installation interface with an optional keyway.
  • High performance：Offers high precision, low noise, high response, and high instantaneous output capability, suitable for applications requiring high dynamic performance.
  • High servo control bandwidth：Capable of fast response to control commands, achieving high-precision motion control.
  • High acceleration torque：Supports rapid dynamic operations, enhancing system response speed and efficiency.
Advantages
  • Precise control capability：Can perform current, speed, and position control through the Drive, demonstrating quick positioning, excellent operational stability, and load-change adaptation advantages.
  • Better than the previous FR series：Enhanced maximum speed, higher resolution feedback, and more compact size.