Industry Solution Semiconductor Industry

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Technical Support

Machine Tool

Automation

Semiconductor

Automatic Loading and Unloading for Large PCB Boards

In the application of automatic loading and unloading of large PCB boards, this process is a critical step in the manufacturing of PCBs. It is typically used in high-efficiency, large-scale production. To improve quality, semiconductor processes and automation are introduced, accelerating process operations and reducing the required space. Semiconductor subsystems are needed to help customers achieve process stability and rapid automation solutions.

Requirements for Semiconductor Subsystems

The moving axis can be equipped with a Wafer Robot to assist in loading and unloading of wafers, transferring them to the next workstation or placing them in designated positions, and performing inspection tasks. It features high precision and flexibility, capable of accurately handling and transporting wafers to ensure process accuracy and efficiency, enhancing automation control capabilities in the manufacturing process.

* Click the product in the image to view detailed features.

RWDE Dual-arm Wafer Robot

Features

Utilizes high-precision, high-rigidity direct-drive motors.
Achieves repeatability accuracy of ±0.1mm, has a small turning radius, and optimizes space usage.
Can be equipped with HIWIN’s self-manufactured key components and developed software applications.

Advantages

Vertical integration of hardware and software：HIWIN provides customers with complete solutions.
Customized assembly：Can provide customized robot specifications to meet customer production needs.

Single Axis : Standard

Features

Easy installation with fast and accurate positioning capabilities.
Includes a Drive, supporting long strokes and multiple movers.

Advantages

Offers short lead times, high responsiveness, high precision, and low wear.
Enhances production efficiency and capacity through high-speed movement and simultaneous multi-position operation.